Electronic devices with display and touch sensor structures

ABSTRACT

Display layers and touch sensor layers may be overlapped by enclosure walls in an electronic device. The electronic device may have a front wall and opposing rear wall and curved sidewalls. The front wall and the curved sidewalls may be formed from a glass layer or other transparent member. A touch sensor layer and display layer may extend under the glass layer with curved sidewalls. A touch sensor layer may also extend under the opposing rear wall. A foldable electronic device may have a flexible transparent wall portion that joins planar transparent walls. Components may be interposed between the transparent planar walls and opaque walls. Display and touch layers may be overlapped by the transparent walls and the transparent flexible wall portion. Touch sensor structures may also be overlapped by the opaque walls.

This application claims the benefit of provisional patent applicationNo. 62/171,634, filed Jun. 5, 2015, which is hereby incorporated byreference herein in its entirety.

BACKGROUND

This relates generally to electronic devices, and, more particularly, toelectronic devices with touch sensors and displays.

Electronic devices such as cellular telephones, tablet computers,watches, laptop computers, and other devices often contain displays.Touch sensors may be used to provide displays with the ability tocapture touch input from a user.

It can be challenging to gather touch input from a user and to displayimages for a user efficiently. For example, when a user supplies touchinput to a touch screen display, the user's hand may block images thatare being displayed on the display. Buttons and other input devices maybe used to gather input from a user, but this type of input device maynot be as convenient and versatile as a touch sensor. Displays aresometimes not visible from certain directions and may be smaller thandesired.

It would therefore be desirable to be able to provide electronic deviceswith enhanced touch sensor and display structures.

SUMMARY

An electronic device may have an enclosure with walls formed fromtransparent and opaque materials. Display layers may be mounted undertransparent portions of the walls. Touch sensor layers may be mountedunder opaque and transparent wall portions.

The electronic device may have a front wall and opposing rear wall.Sidewalls may extend between the front and rear wall. The sidewalls maybe flat or may be curved. The front wall and portions of sidewalls maybe formed from a glass layer or other transparent member. A touch sensorlayer and display layer may extend under the front and sidewall portionsof the glass layer. A touch sensor layer may also extend under theopposing rear wall.

A foldable electronic device may have a flexible transparent wallportion that joins planar transparent walls. Components may beinterposed between the transparent planar walls and opaque walls.Display and touch layers may be overlapped by the transparent walls andthe transparent flexible wall portion. Additional touch layers may beoverlapped by the opaque walls.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an illustrative electronic device inaccordance with an embodiment.

FIG. 2 is a schematic diagram of an illustrative electronic device inaccordance with an embodiment.

FIG. 3 is a cross-sectional side view of an electronic device inaccordance with an embodiment.

FIG. 4 is a cross-sectional side view of an illustrative electronicdevice having a vertical sidewall portion in accordance with anembodiment.

FIG. 5 is a cross-sectional side view of an illustrative electronicdevice with a sidewall portion that slopes away from a front devicesurface in accordance with an embodiment.

FIG. 6 is a cross-sectional side view of an illustrative electronicdevice with a sidewall portion that slopes away from a rear devicesurface in accordance with an embodiment.

FIG. 7 is a cross-sectional side view of an illustrative electronicdevice with a curved sidewall in accordance with an embodiment.

FIG. 8 is a top view of an illustrative display in accordance with anembodiment.

FIG. 9 is a top view of an illustrative touch sensor in accordance withan embodiment.

FIG. 10 is a cross-sectional side view of a portion of an electronicdevice with a wall such as an opaque wall and a touch sensor that isattached to an inner surface of the wall in accordance with anembodiment.

FIG. 11 is a cross-sectional side view of a portion of an electronicdevice with an opaque wall having an inner surface on which a touchsensor has been formed as a coating in accordance with an embodiment.

FIG. 12 is a cross-sectional side view of a portion of an electronicdevice with a clear wall having an inner surface on which a touch sensorhas been formed as a coating and to which a display layer has beenattached using adhesive in accordance with an embodiment.

FIG. 13 is a cross-sectional side view of a portion of an electronicdevice with a clear wall having an inner surface to which a touch sensorlayer and display have been attached in accordance with an embodiment.

FIG. 14 is a perspective view of an illustrative electronic device ofthe type that may be provided with display and touch sensor structuresin accordance with an embodiment.

FIGS. 15, 16, and 17 are cross-sectional side views of illustrativeelectronic devices with touch sensor and display structures inaccordance with an embodiment.

FIG. 18 is a perspective view of an illustrative folding electronicdevice of the type that may be provided with display and touch sensorstructures in accordance with an embodiment.

FIG. 19 is a perspective view of the electronic device of FIG. 18 in anunfolded configuration in accordance with an embodiment.

FIG. 20 is a cross-sectional side view of an illustrative device of thetype shown in FIGS. 18 and 19 in a folded configuration in accordancewith an embodiment.

FIG. 21 is a diagram of illustrative equipment that may be used infabricating electronic devices with touch sensors and display structuresin accordance with an embodiment.

FIG. 22 is a cross-sectional side view of an illustrative electronicdevice during fabrication operations in which flexible structures for adisplay and/or touch sensor are being laminated to the planar and curvedinner surfaces of an enclosure wall in accordance with an embodiment.

FIGS. 23 and 24 are cross-sectional side views of an illustrativeelectronic device during fabrication operations in which structures fora display and/or touch sensor are being deposited and patterned on theplanar and curved inner surfaces of an enclosure wall in accordance withan embodiment.

FIGS. 25 and 26 are cross-sectional side views of an illustrativeelectronic device during fabrication operations in which structures fora display and/or touch sensor are being fabricated in a planarconfiguration and then bent to form a wall with curved end portions inaccordance with an embodiment.

FIG. 27 is a cross-sectional side view of an illustrative electronicdevice with two flexible portions to allow the device to fold along tworespective bend axes in accordance with an embodiment.

FIG. 28 is a cross-sectional side view of an illustrative electronicdevice with three or more flexible portions to allow the device to foldalong three or more respective bend axes in accordance with anembodiment.

FIG. 29 is a cross-sectional side view of a flexible electronic devicehinge region having flexible layers of material that form a hinge inaccordance with an embodiment.

FIG. 30 is a cross-sectional side view of a flexible electronic devicehinge region having a flexible accordion structure in accordance with anembodiment.

FIG. 31 is a cross-sectional side view of a flexible electronic devicehinge region having mating structural members that rotate with respectto each other about a pivot structure such as a pin to form a hinge inaccordance with an embodiment.

DETAILED DESCRIPTION

An electronic device may be provided with input-output devices to gatherinput and to provide output to a user. The input-output devices mayinclude touch sensor structures. The electronic device may have controlcircuits, batteries, and other components that are enclosed within thewalls of an enclosure. The walls may have opaque portions andtransparent portions. The opaque portions may include opaque plastic,metal, fiber-composite materials and layers of other materials withfibers, ceramic, and other opaque materials and may include transparentmaterial that is coated with one or more opaque layers (e.g., clearglass, clear plastic, sapphire, or other transparent material coated onan inner surface with an opaque masking layer). The transparent wallportions may be formed from clear glass, clear plastic, sapphire, orother transparent materials.

Display structures may be mounted behind the transparent portions andmay display images for a user. The images may include video, graphics,text, virtual buttons, and other visual content. The touch sensorstructures may be mounted behind the transparent portions and behind theopaque portions. The touch sensor structures may have portions thatoverlap the display structures, thereby forming a touch screen displayregion on the device. The touch sensor structures may also have portionsthat do not overlap the display structures and which therefore serveexclusively as touch sensor inputs.

Touch sensor structures and display structures may be formed from thinlayers of material and may therefore sometimes be referred to touchsensor layers and display layers. The touch sensor and display layersmay be formed on rigid substrates such as glass layers and rigid printedcircuit board layers and/or may be formed on flexible substrates (e.g.,flexible printed circuit material such as flexible layers of polyimideor sheets of other flexible polymer material). In some configurations,touch sensor structures and display structures may be formed as coatinglayers on the surface of an enclosure wall. Combinations of theseapproaches may also be used, if desired.

A perspective view of an illustrative electronic device of the type thatmay be provided with touch sensor structures and display structures isshown in FIG. 1. Electronic device 10 may be a computing device such asa laptop computer, a computer monitor containing an embedded computer, atablet computer, a cellular telephone, a media player, or other handheldor portable electronic device, a smaller device such as a wrist-watchdevice (e.g., a watch with a wrist strap), a pendant device, a headphoneor earpiece device, a device embedded in eyeglasses or other equipmentworn on a user's head, or other wearable or miniature device, atelevision, a computer display that does not contain an embeddedcomputer, a gaming device, a navigation device, an embedded system suchas a system in which electronic equipment with a display is mounted in akiosk or automobile, equipment that implements the functionality of twoor more of these devices, or other electronic equipment. In theillustrative configuration of FIG. 1, device 10 is a portable devicesuch as a cellular telephone, media player, tablet computer, wristdevice, or other portable computing device. Other configurations may beused for device 10 if desired. The example of FIG. 1 is merelyillustrative.

In the example of FIG. 1, device 10 includes a display such as display14. The components of device 10 may be mounted within enclosure walls12. Some of enclosure walls 12 such as illustrative front face wall 12-6may be formed from clear glass, clear plastic (e.g., rigid and/orflexible plastic with a clear hard coating such as an inorganicantiscratch layer formed from silicon nitride, metal nitride, titaniumnitride, silicon oxide, metal oxide, diamond-like coating material, orother material with abrasion resistance), sapphire, or other transparentmaterial and can therefore serve as covers for display layers. In thiscontext the walls may sometimes be referred to as display cover layers(i.e., wall 12-6 may cover a display layer that displays images and thatserves as display 14). Other portions of enclosure walls 12 may beformed from opaque plastic (e.g., flexible and/or rigid plastic coveredwith a hard coating layer), metal, or clear material coated with opaquemasking material (e.g., an inner layer of black ink). Opaque wallportions of the enclosure for device 10 may sometimes be referred to ashousing structures.

The display layers of device 10 need not be confined to front wall 12-6of device 10. In the illustrative configuration of FIG. 1, device 10 hassix sides: right sidewall 12-1, left sidewall 12-2, top sidewall 12-3,bottom sidewall 12-2, rear wall 12-5, and front wall 12-6. Displaylayers and touch sensor layers in device 10 can cover some or all ofthese surfaces. As one example, touch sensor layers may cover allsurfaces of device 10 and the display structures of device 10 may beconfined to central (“active area”) portion AA of front wall 12-6. Asanother example, the display for device 10 may cover portion AA on frontwall 12-6 and the touch sensors for device 10 may cover front wall 12-6including portion AA and may cover opaque (“inactive area”) portions IAat the upper and lower ends of front face 12-6. Yet another exampleinvolves wrapping a display around some or all of device 10 (e.g., tocover a strip in the center of device 10 including active area AA,corresponding portions of sidewalls 12-1 and 12-2, and some or all ofthe center of rear face 12-5). In this type of arrangement, touchsensors may be formed in at least the areas covered with the displaystructures and may optionally cover other portions of device 10 (e.g.,ends 12-2 and 12-1, inactive areas IA on front face 12-6, etc.).

Openings may be formed in the walls of enclosure 12. For example,openings such as opening 16 may be formed to accommodate a button,openings such as opening 18 may be formed to accommodate a speaker port,openings such as opening 22 in bottom sidewall 12-2 may be formed toaccommodate a connector port, and adjacent openings such as openings 20and 24 may be used to form speaker and microphone ports, respectively(as examples).

FIG. 2 is a schematic diagram of device 10. As shown in FIG. 2,electronic device 10 may have control circuitry 30. Control circuitry 30may include storage and processing circuitry for supporting theoperation of device 10. The storage and processing circuitry may includestorage such as hard disk drive storage, nonvolatile memory (e.g., flashmemory or other electrically-programmable-read-only memory configured toform a solid state drive), volatile memory (e.g., static or dynamicrandom-access-memory), etc. Processing circuitry in control circuitry 30may be used to control the operation of device 10. The processingcircuitry may be based on one or more microprocessors, microcontrollers,digital signal processors, baseband processors, power management units,audio chips, application specific integrated circuits, etc.

Input-output circuitry in device 10 such as input-output devices 34 maybe used to allow data to be supplied to device 10 and to allow data tobe provided from device 10 to external devices. Input-output devices 34may include buttons, joysticks, scrolling wheels, touch pads, key pads,keyboards, microphones, speakers, tone generators, vibrators, cameras,sensors (e.g., ambient light sensors, proximity sensors, magneticsensors, force sensors, touch sensors such as touch sensors 32,accelerometers, and other sensors), light-emitting diodes and otherstatus indicators, data ports, displays such as display 14, etc. A usercan control the operation of device 10 by supplying commands throughinput-output devices 34 and may receive status information and otheroutput from device 10 using the output resources of input-output devices34.

Touch sensors 32 may be formed using any suitable touch technology. Asan example, touch sensors 32 may be formed from one or more patternedlayers of capacitive touch sensor electrodes. Other types of touchsensor may be used in device 10 if desired (e.g., touch sensors havingtouch sensor components such as resistive touch sensor components,acoustic touch sensor components, force-based touch sensor components,light-based touch sensor components, etc.). Touch sensor structures maybe transparent and/or may be opaque. For example, touch sensors that aretransparent may have transparent touch sensor structures such ascapacitive touch screen electrodes that are formed from an array ofindium tin oxide electrodes or other transparent conductive electrodestructures. If desired, transparent touch sensor structures may havethin metal lines (e.g., nanostructures) that are sufficiently small tobe invisible to the eye. Opaque capacitive touch sensors may be formedfrom opaque capacitive touch sensor electrodes such as metal capacitivetouch sensor electrodes.

Each display layer for the display(s) 14 in device 10 may include anarray of pixels formed from liquid crystal display (LCD) components, anarray of electrophoretic pixels, an array of plasma pixels, an array oforganic light-emitting diode pixels, an array of discrete light-emittingdiodes, an array of electrowetting pixels, or pixels based on otherdisplay technologies.

Control circuitry 30 may be used to run software on device 10 such asoperating system code and applications. During operation of device 10,the software running on control circuitry 30 may use touch sensors 32 indevices 34 to gather touch sensor input from a user. A user may, forexample, supply touch input using one or more fingers and/or otherexternal objects (e.g., a stylus, etc.). The touch input may be suppliedto any of the surfaces of device 10 that include touch sensor structures32 (e.g., walls 12-1, 12-2, 12-3, 12-4, 12-5, and/or 12-6.). Touch inputmay include multi-touch gestures and other gestures (e.g., swipes,finger pinches, taps, etc.). In gaming applications and otherapplications, it may be desirable to use a touch sensor on the rearsurface of device 10 to gather touch input while displaying associatedvisual information on a display on the opposing front surface of device10. Configurations in which a user supplies touch input to the upper andlower ends of device 10 (e.g., in inactive areas IA) while holdingdevice 10 in a landscape configuration to view images in active area AAof FIG. 1 may also be used. Touch input on sidewalls in device 10 may beused as a control for a camera (e.g., a virtual shutter button input),may be used as input in other virtual button scenarios, may be used inimplementing a volume slider button or a slider button for controllingother device operations (e.g., screen brightness, color settings,contrast settings, etc.).

A cross-sectional side view of an illustrative device with touch sensorand display structures is shown in FIG. 3. As shown in FIG. 3, device 10may have walls such as opposing front wall 12-6 and rear wall 12-5 andwalls such as left sidewall 12-4 and right sidewall 12-1. Batteries,integrated circuits, and other electrical components 50 (see, e.g.,control circuitry 30 and input-output devices 34) may be enclosed withinthe device enclosure formed from walls 12. As shown in FIG. 3,components 50 may be mounted on one or more substrates such as substrate48. Substrates such as substrate 48 may include printed circuits (e.g.,rigid printed circuit boards formed from rigid printed circuit boardmaterial such as fiberglass-filled epoxy and flexible printed circuitsformed from flexible layers of polymer such as polyimide or otherflexible sheets of polymer), molded plastic, glass, ceramic, and otherdielectric substrate materials.

Portions of walls 12 of device 10 may be transparent. In theillustrative configuration of FIG. 3, for example, front wall 12-6 hasbeen formed from a transparent material such as glass (i.e., wall 12-6in the FIG. 3 example may form a planar display cover layer). Displaylayer 46 (e.g., a liquid crystal display layer, an organiclight-emitting diode display layer, or any other display layer fordisplay 14) may form images (i.e., display layer 46 may contain an arrayof pixels to form display 14). Edge portions IA may have an innersurface coated with black masking layer BM, thereby rendering theseportions of wall 12-6 opaque. Touch sensor circuitry 32 may be formed inactive area AA and in inactive areas IA. This allows a user to supplytouch input in areas IA (e.g., using the user's thumbs, other fingerssuch as finger 52 of FIG. 3, and/or other external objects) withoutblocking display layer 46. Other portions of the enclosure of device 10may be opaque. For example, the sidewalls of device 10 such as walls12-4 and 12-1 and upper and lower walls 12-2 and 12-3 (FIG. 1) may beformed form opaque material and rear wall 12-5 may be formed form opaquematerial. As shown in FIG. 3, touch sensor layer 32 may be formed on theinner surfaces of some or all of these opaque walls to provide theexterior surfaces of these portions of device 10 with touch inputcapabilities.

In the illustrative example of FIG. 3, the enclosure sidewalls fordevice 10 are flat and are oriented vertically. Cross-sectional sideviews of an edge portion of device 10 in scenarios in which device 10has different illustrative sidewall profiles are shown in FIGS. 4, 5, 6,and 7. In FIG. 4, sidewall 12-4 has a vertical shape and runsperpendicular to the planes of upper wall 12-6 and rear wall 12-5. Upperwall 12-6 and rear wall 12-5 may be planar or may have convex and/orconcave shapes. The example of FIG. 5 shows how sidewall 12-4 may slopeaway from front wall 12-6. The example of FIG. 6 show how sidewall 12-4may slope away from rear wall 12-5. Another illustrative configurationis shown in FIG. 7. With the arrangement of FIG. 7, sidewall 12-4 has acurved shape. The profile of a curved wall in device 10 may besemicircular, may have one or more flat sections joined by one or morecurved portions, may have a half-oval shape, or may have any othercurved and/or straight wall profile. The arrangement of FIG. 7 is shownas an example. Sidewall profiles of the types shown in FIGS. 4, 5, 6,and 7, may be used on one, two, or three or more peripheral edges ofdevice 10.

An illustrative display layer for displays in device 10 such as display14 is shown in FIG. 8. As shown in FIG. 8, display layer 46 may includean array of pixels 66 such as pixel array 44. Pixel array 44 may becontrolled using control signals produced by display driver circuitry.Display driver circuitry may be implemented using one or more integratedcircuits (ICs) and/or thin-film transistors or other circuitry. Thedisplay driver circuitry may include, for example, display drivercircuitry 60 that receives image data from control circuitry 30 via path62 and gate driver circuitry 64. The display driver circuitry mayconvert the image data into signals for controlling pixels 66 of pixelarray 44.

Pixel array 44 may contain rows and columns of pixels 66. The circuitryof pixel array 44 (i.e., the rows and columns of pixel circuits forpixels 66) may be controlled using signals such as data line signals ondata lines D and gate line signals on gate lines G. Data lines D andgate lines G are orthogonal. For example, data lines D may extendvertically and gate lines G may extend horizontally (i.e., perpendicularto data lines D).

Pixels 66 in pixel array 44 may contain thin-film transistor circuitry(e.g., polysilicon transistor circuitry, amorphous silicon transistorcircuitry, semiconducting-oxide transistor circuitry such as indiumgallium zinc oxide transistor circuitry, other silicon orsemiconducting-oxide transistor circuitry, etc.) and associatedstructures for producing electric fields across a liquid crystal layer(in a liquid crystal display), for applying control signals tolight-emitting diodes (in an organic light-emitting diode display orother display with pixels formed from light-emitting diodes), or forproducing other pixel control signals (e.g., control signals for pixelsin other types of displays). The thin-film transistor structures thatare used in forming pixels 66 may be located on a thin-film transistorsubstrate such as a flexible polymer layer, a layer of glass, or othersubstrate(s) 68.

Gate driver circuitry 64 may be used to generate gate signals on gatelines G. The gate driver circuitry may be formed from thin-filmtransistors on the thin-film transistor layer or may be implemented inseparate integrated circuits. The data line signals on data lines D inpixel array 44 carry analog image data (e.g., voltages with magnitudesrepresenting pixel brightness levels). During the process of displayingimages on display layer 46, a display driver integrated circuit or othercircuitry 60 may receive digital data from control circuitry 30 via path62 and may produce corresponding analog data signals. The analog datasignals may be demultiplexed and provided to data lines D. If desired,other types of control schemes may be used for pixels 66 in array 44 ofdisplay layer 46. The arrangement of FIG. 8 is merely illustrative.

FIG. 9 is a diagram of an illustrative touch sensor for device 10. Touchsensor layers for device 10 may be formed using any suitable touchtechnology. With the example of FIG. 9, touch sensor layer 32 is acapacitive touch sensor layer having capacitive touch sensor electrodes70 and 72. Touch sensor controller 74 may supply drive signals to thetouch sensor electrodes while gathering corresponding sense signals fromthe electrodes, thereby determining the location of a user's touchwithin the electrodes. Electrodes 70 and 72 may be formed from atransparent conductive material such as indium tin oxide or invisiblythin conductive lines (e.g., in configurations in which it is desiredfor layer 32 to be transparent) or from opaque materials such as metal(e.g., in configurations in which layer 32 need not be transparent).Electrodes 70 and 72 may be formed on opposing sides of a flexibleprinted circuit, may be formed as multiple layers in a touch sensorcoating formed on walls 12 or other portions of device 10, may be formedusing single-sided electrode patterns, may be formed using double-sidedelectrode patterns, may be formed on the same substrate as pixels 66(e.g., in an arrangement in which some of the display structures andsome of the touch sensor structures are shared and form a unitary touchand display layer), may be formed using patterns of squares, diamonds,or other capacitive electrode shapes, or may be formed using any othersuitable touch sensor configuration. The configuration of FIG. 9 inwhich sets of perpendicular touch sensor capacitive electrode strips arearranged in a grid is merely illustrative.

FIGS. 10, 11, 12, and 13 are cross-sectional side views of a portion ofenclosure wall 12 for device 10 that have been covered with displaylayers and/or touch sensor layers using different illustrativeconfigurations.

In the arrangement of FIG. 10, wall 12 is opaque and touch sensor layer32 has been attached to wall 12 using adhesive layer 80. Layer 32 maybe, for example, a flexible touch sensor panel formed on a flexibleprinted circuit substrate using metal capacitive touch sensor electrodes(e.g., wires, metal strips, metal pads, etc.).

In the arrangement of FIG. 11, wall 12 is opaque. Touch sensor layer 32has been fabricated as a coating on the inner surface of wall 12 bydepositing and patterning touch sensor structures. As an example,electrodes 70 may be deposited as a coating layer on the inner surfaceof wall 12 and patterned using photolithography, laser etching, etc.Shadow mask patterning may also be used, if desired. Dielectric layer 82(e.g., a polymer or an inorganic dielectric layer) may then be depositedover electrodes 70. Electrodes 72 may be deposited and patterned ondielectric layer 82 to form touch sensor layer 32.

In portions of device 10 in which display output is desired, wall 12 maybe transparent. An illustrative portion of wall 12 that is transparentis shown in FIG. 12. In the arrangement of FIG. 12, touch sensor layer32 has been formed as a coating on the inner surface of transparent wall12 (e.g., by depositing electrodes 70, dielectric coating 82, andelectrodes 72). Display layer 46 (e.g., a display formed form a rigidsubstrate or a flexible polymer substrate) may be attached to the innersurface of transparent wall 12 over touch sensor layer 32 using a layerof clear adhesive such as adhesive 86. If desired, a display layer maybe deposited and patterned as a coating on touch sensor layer 32 and/ordisplay layer structures and touch sensor structures may be formed as aunitary layer and deposited on wall 12 as a coating or attached to wall12 with adhesive.

If desired, both the touch sensor layer and the display layer may beprovided on flexible substrates or other suitable substrates that areattached to the inside of a transparent portion of wall 12 usingadhesive layers. This type of arrangement is shown in FIG. 13. As shownin FIG. 13, adhesive layer 80 may be used to attach touch sensor layer32 (e.g., a flexible printed circuit touch sensor formed from capacitivetouch sensor electrodes on a flexible polymer substrate) to transparentwall 12 and adhesive layer 86 may be used to attach display layer 46(e.g., a flexible display such as an organic light-emitting diodedisplay, an electrophoretic display, or other suitable display with anarray of pixels 66) to touch sensor layer 32. Adhesive layers 80 and 86may be transparent to allow pixels 66 to produce images that are visiblefrom outside of device 10 through transparent wall 12.

The configurations for incorporating touch and display layers intodevice 10 under opaque and transparent portions of wall 12 that aredescribed in connection with FIGS. 10, 11, 12, and 13 are merelyillustrative. Other types of display and touch layer configuration maybe used, if desired (e.g., arrangements in which a single substrate isused to support both touch and display circuitry, etc.). Moreover, insome situations display layer 46 may overlap only a portion of touchsensor layer 32 (e.g., layer 32 may have portions that extend out fromunder display layer 46 and are therefore uncovered by display layer 46).Display layer 46 may also have potions that do not overlap any portionof touch sensor layer 32.

In configurations for device 10 in which some of the walls of device 10are curved, flexible touch and/or display layers may be provided withcorresponding curved shapes (e.g., by bending flexible display and/ortouch sensor layers, etc.). Consider, as an example, the arrangement ofdevice 10 that is shown in FIG. 14. As shown in the example of FIG. 14,device 10 may have six enclosure walls: opposing left and rightsidewalls 12-4 and 12-1, opposing top and bottom sidewalls 12-3 and12-2, and opposing front and rear sidewalls 12-6 and 12-5. Inactiveareas IA may extend as strips around some or all of the top and bottomends of enclosure 12. Display 14 may be formed in an active area AA thatextends over at least the center portion of front wall 12-6. Displaylayer(s) 46 for display 14 may optionally cover some or all of walls12-4 and 12-6 and/or may cover some or all of rear wall 12-5. Touchsensor layer(s) 32 may cover front wall 12-6 in active area AA andoptionally in inactive areas IA, may cover some or all of sidewalls 12-4and 12-6, may cover some or all of rear wall 12-5, and may cover some orall of upper and lower sidewalls 12-2 and 12-3. If desired, displaylayers 46 may also cover portions of device 10 such as upper and lowersidewalls 12-2, 12-3, rear wall 12-5, etc.

In the illustrative configuration of FIG. 14, display and/or touchlayers may have curved shapes that match the curved profiles of curvedsidewalls 12-4 and 12-1. FIGS. 15, 16, and 17 are cross-sectional sideviews of a device such as device 10 of FIG. 14 taken along line 400 andviewed in direction 402.

Illustrative device 10 of FIG. 15 has a downward facing planar touchsensor such as touch sensor layer 32-2 and has an upwards facing touchsensor layer with curved sidewall portions such as touch sensor layer32-1. Front wall 12-6 and sidewalls 12-4 and 12-1 may be transparent andmay, if desired, be formed from an integral member (e.g., a unitaryglass layer, etc.) with a planar center portion (forming wall 12-6) andcurved edge portions (forming curved sidewalls 12-4 and 12-1). Displaylayer 46 may have a planar portion that extends under transparent frontplanar wall 12-6 and integral curved edge portions that extend undertransparent curved sidewalls 12-4 and 12-1. Touch sensor layer 32-1 istransparent to allow images from display layer 46 to be viewed throughwalls 12-1, 12-4, and 12-6. Touch sensor 32-2 may be overlapped by rearwall 12-5 and may gather touch input through rear wall 12-5. Rear wall12-5 may be opaque and touch sensor 32-2 may be transparent or opaque.Electrical components 404 may be housed in the interior cavity of device10 that is enclosed by the enclosure walls.

Illustrative device 10 of FIG. 16 has an upwards facing planar touchsensor such as touch sensor layer 32-1 and has a downwards facing touchsensor layer with curved sidewall portions such as touch sensor layer32-2. Rear wall 12-5 and sidewalls 12-4 and 12-1 may be opaque and may,if desired, be formed from an integral member with a planar centerportion (forming wall 12-5) and curved edge portions (forming curvedsidewalls 12-4 and 12-1). Touch sensor layer 32-2 may be transparent oropaque. Display layer 46 and touch sensor layer 32-1 lie under planarfront wall 12-6. Front wall 12-6 and touch sensor layer 32-1 may betransparent to allow display 46 to produce visible images. Electricalcomponents 404 may be housed in the interior cavity of device 10 that isenclosed by the enclosure walls.

Illustrative device 10 of FIG. 17 has an upper wall portion formed fromupper left sidewall portion 12-4-1, front wall 12-6, and upper rightsidewall portion 12-1-1. The upper wall portion may be transparent andmay overlap transparent touch sensor layer 32-1 and display layer 46,each of which may have curved edges that conform to the curved edgeshape of the upper wall portion. Device 10 may also have a lower wallportion formed from lower left sidewall portion 12-4-2, rear wall 12-5,and lower right sidewall portion 12-1-2. The lower wall portion may beopaque and may overlap a transparent or opaque touch sensor layer suchas touch sensor layer 32-1. Electrical components 404 may be housed inthe interior cavity of device 10 that is enclosed by the enclosurewalls.

If desired, device 10 may have an enclosure that allows device 10 to befolded one or more times along one or more fold axes. In the example ofFIG. 18, the enclosure of device 10 is flexible along fold axis (bendaxis) 100. This allows device 10 to be folded and unfolded like a book.As shown in FIG. 18, end 104A of a first half of device 10 is locatedadjacent to sidewall 12-1A (e.g., a curved sidewall) and end 104B of asecond half of device 10 is located adjacent to sidewall 12-1B (e.g., acurved sidewall). Opposing curved sidewall 12-4 runs parallel to foldaxis 100 and may be formed from a flexible material. In the folded(closed) configuration of FIG. 18, ends 104A and 104B are adjacent toeach other. When it is desired to open device 10, ends 104A and 104B maybe moved away from each other in directions 102, causing device 10 andflexible wall portion 12-4 to flex along bend axis 100.

Display layer 46 for device 10 may be located on rear wall portions12-5A and 12-5B and/or may be located on front wall portions 12-6A and12-6B. Touch sensor layer 32 may likewise be located on rear wallportions 12-5A and 12-5B and/or may be located on front wall portions12-6A and 12-6B.

Portions of touch sensor layer 32 and/or display layer 46 may cover someor all of the sidewalls of device 10. For example, a continuous displaymay be formed from display layers on walls 12-6A and 12-6B by ensuringthat display layer 46 lies under curved wall 12-4 (which lies betweenwalls 12-6A and 12-6B when device 10 is in its unfolded state). When adevice of this configuration is opened, walls portions 12-6A, 12-4, and12-6B form a unitary display for device 10, as shown in FIG. 19.Sidewall portions 12-1A and 12-1B and, if desired, some or all of wallportions 12-5B and 12-5A may optionally also be covered with displaylayer 46 and/or touch layer 32. Display layer 46 may extend along all ofdevice 10 parallel to bend axis 100 or may be restricted to a centralstrip (shown as area AA) that lies between respective strips of inactiveareas IA on the upper and lower edges of device 10. Touch sensor layer32 may extend under area AA and may, if desired, extend under some orall of areas IA.

A cross-sectional side view of device 10 of FIG. 18 taken along line 412of FIG. 18 and viewed in direction 414 in an illustrative configurationin which touch sensor layers are provided on surfaces 12-5A, 12-5B,12-6A, 12-6B, 12-4, 12-1A, and 12-1B is shown in FIG. 20. Supportstructures 410 may be formed form an elastomeric material and/or otherbendable materials to allow device 10 to be opened and closed by bendingthe enclosure for device 10 along bend axis 100. Transparent touchsensor layer 32-1 and display layer 46 are overlapped by transparentwalls 12-1A, 12-6A, 12-4, 12-6B, and 12-1B. Touch sensor layer 32-2(e.g., a transparent or opaque touch sensor layer) may be overlapped bywalls 12-5A and 12-5B (which may be opaque). Electrical components 404may be housed in the interior of device 10 that is enclosed by theenclosure walls (i.e., components 404 may be interposed between wall12-6A and 12-5A and between wall 12-6B and 12-5B. The walls of device 10of FIG. 20 (e.g., wall portion 12-4 and optionally other walls) may beflexible to accommodate opening and closing of device 10.

Illustrative equipment of the type that may be used in fabricatingdevice 10 is shown in FIG. 21. The equipment of FIG. 21 may be used inprocessing display layers 46, touch sensor layers 32, walls 12, andother structures for device 10 (shown collectively as structures 208).

Molding equipment 200 may be used to mold transparent glass, transparentsapphire, transparent plastic, or other transparent materials (e.g.,under heat and pressure). Equipment 200 may be used to form walls withintegral curved edges and other structures 208.

Equipment 202 may include physical vapor deposition equipment, equipmentfor applying conductive ink, equipment for depositing and patterningsemiconductor thin films, equipment for depositing and patterning metaland dielectric layers, printing equipment, equipment for deposingmaterials by spraying, dipping, screen printing, pad printing, needledispensing, or other coating techniques, photolithographic patterningequipment, laser and mechanical patterning equipment, and otherequipment for depositing and patterning layers of material forstructures such as touch sensor layers 32 and display layers 46 (e.g.,structures 208). Equipment 202 may be used to apply hard coatings toopaque and/or transparent plastic layers (flexible and/or rigid plastic)or other layers. A hard coating may, for example, form an antiscratchlayer. The hard coating may be formed from silicon nitride, metalnitride, titanium nitride, silicon oxide, metal oxide, diamond-likecoating material, or other material with abrasion resistance).

Lamination equipment 204 may be used to press layers of materialtogether for structures 208 under heat and pressure and may be used toattach layers of material together using adhesive. Roller-basedlamination equipment may be used to attach layers of material to curvedwalls.

Equipment 206 may be used to assemble structures 208 to form device 10(e.g., using computer-controlled positioners, machine vision equipment,etc.).

FIG. 22 shows how layers such as illustrative flexible layer 304 (e.g.,display layer 46 and/or touch sensor layer 32) may be laminated to theinside of housing wall 12. Roller 306 may be used to press layer 304against the planar and curved inner surfaces 312 of wall 12 indirections such as direction 310, thereby causing adhesive layer 302 toattach layer 304 to wall 12. Wall 12 may have a planar portion andcurved sidewall portions and may be supported by support structure 320(e.g., a support structure that uses a vacuum to hold wall 12 in placeduring processing).

If desired, display layer 46 and/or touch sensor layer 32 may bedeposited and patterned as coating layers on the inner surface of wall12, as shown in FIG. 23 (in which deposition and patterning equipment314 is depositing and patterning layer 316) and FIG. 24 in whichpatterning of layer 316 is complete and patterned layer 316′ (e.g., atouch and/or display layer) is present on the planar and curved innersurfaces of wall 12.

In the illustrative arrangement of FIGS. 25 and 26, touch sensor and/ordisplay layer structures such as structures 316′ are deposited andpatterned on the surface of wall 12 (FIG. 25) before wall 12 is moldedor otherwise formed into its final shape by bending the ends of wall 12.Following bending of the ends of wall 12 in directions 350, wall 12 mayhave curved sidewall portions as shown in FIG. 26.

As shown in FIG. 27, electronic device 10 may have two flexible portions550 to allow device 10 to fold along two respective bend axes 100A and100B (e.g., to allow device 10 to be placed in an open position, aclosed position, and one or more intermediate positions). As shown inFIG. 28, electronic device 10 may have three or more flexible portions550 that allow device 10 to fold along three or more respective bendaxes 100A, 100B, 100C . . . . (e.g., to allow device 10 to be placed inan open position, a closed position, and one or more intermediatepositions). In general, device 10 may have any suitable number of hingeregions that allow device 10 to flex. Some or all of the exposedexternal layers of display 14 in devices such as these may be providedwith layers for displays 14 and/or touch sensors 32 (e.g., a device withopposing front and rear surfaces covered with display and/or touchlayers may have no hinges, one hinge, two hinges, three hinges, four ormore hinges, etc.).

The flexible regions in device 10 may be provided with hinges based onflexible layers of material (e.g., flexible plastic, flexible metal,etc.), accordion (bellows) structures, pivoting hinge structures, and/orother suitable flexible structures.

In the illustrative configuration of FIG. 29, hinge 500 has been formedfrom flexible layer 502 (e.g., a flexible core layer of an elastomericmaterial, a flexible foam, a flexible polymer layer, a flexible metallayer, and/or other flexible layers) that has been covered with one ormore layers of material 504 for forming displays 14 and/or touch sensors32. Layers 504 may be formed one or both sides of device 10. Hinges suchas hinge 500 may allow device 10 to bend around bend axis 100.

FIG. 30 shows how hinge 600 may be formed from flexible accordion(bellows) structures 602. One or more flexible layers 604 for displays14 and/or touch sensors 32 may be formed on the upper and/or lowersurfaces of hinge 600. Accordion structures 602 may be formed frommetal, plastic, or other materials that are sufficiently thin andflexible to allow the accordion structure to bend. Hinges such as hinge600 may allow device 10 to bend around bend axis 100.

In the example of FIG. 31, hinge 700 has been formed from a firststructural member (member 702) that is coupled to a second structuralmember (member 704) by a pivot structure such as a pin and matingopening into which the pin protrudes. This allows hinge 700 to flexabout bend axis 100.

Other structures that flex with respect to each other may be used toform hinges for device 10. The examples of FIGS. 29, 30, and 31 aremerely illustrative.

To help prevent display and touch sensor structures in the flexiblelayers of device 10 from cracking or otherwise developing faults due tostresses induced by bending device 10, these structures may be providedwith stress tolerant features such as locally thinned substrate layers,serpentine metal traces that resist cracking when bent, neutral stressplane adjustments layers such as layers of polymer that can be appliedas coatings in bending regions to help move the neutral stress plane ofbent material into alignment with metal traces in the bending regionsand thereby reduce bend-induced stresses and faults, redundant lines(e.g., stacked metal layers coupled by vias, side-by-side redundantlines, etc.), conductive paths formed from carbon nanotubes, metalpaint, and/or other materials that resist cracking when bent, and/orother structures that help the flexible layers of device 10 resistdamage during bending.

The foregoing is merely illustrative and various modifications can bemade by those skilled in the art without departing from the scope andspirit of the described embodiments. The foregoing embodiments may beimplemented individually or in any combination.

What is claimed is:
 1. An electronic device, comprising: an enclosurehaving opposing front and rear walls and curved sidewalls; touch sensorstructures that are overlapped by the front and rear walls so that thetouch sensor structures gather touch input on the front wall and gathertouch input on the rear wall; and displays structures that areoverlapped by the front wall and at least a portion of the curvedsidewalls, wherein the display structures comprise a display layerhaving an edge, wherein the touch sensor structures comprise a touchsensor layer, wherein the touch sensor layer comprises a first portionthat overlaps the display layer and a second portion that extends beyondthe edge of the display layer, and wherein the second portion of thetouch sensor layer gathers the touch input on an opaque portion of thecurved sidewalls.
 2. The electronic device defined in claim 1 whereinthe touch sensor structures are overlapped by at least part of thecurved sidewalls so that the touch sensor structures gather touch inputon the curved sidewalls.
 3. The electronic device defined in claim 2wherein the curved sidewalls include opposing left and right sidewallsand wherein the touch sensor layer extends under the front wall and hasedges that extend under at least part of the left and right sidewalls.4. The electronic device defined in claim 3 wherein the front wall andthe part of the left and right sidewalls under which the edges of thetouch sensor layer extend form an integral structure.
 5. The electronicdevice defined in claim 4 wherein the integral structure is a layer oftransparent material with curved edges forming the part of the left andright sidewalls under which the edges of the touch sensor layer extend.6. The electronic device defined in claim 5 wherein the layer oftransparent material comprises a layer of material selected from thegroup consisting of: glass and sapphire.
 7. The electronic devicedefined in claim 5 wherein the layer of transparent material comprises alayer of plastic.
 8. The electronic device defined in claim 7 furthercomprising an inorganic coating layer on the layer of plastic.
 9. Theelectronic device defined in claim 1 wherein the front wall and thecurved sidewalls are formed from a unitary layer of glass.
 10. Theelectronic device defined in claim 1 wherein the front wall and thecurved sidewalls are formed from a unitary layer of plastic.
 11. Theelectronic device defined in claim 1 wherein the front wall and thecurved sidewalls are formed from a unitary layer of sapphire.
 12. Anelectronic device that is operable in open and folded configurations,comprising: an enclosure having first and second planar walls, first andsecond curved sidewalls, a flexible wall that lies between the first andsecond planar walls, and third and fourth planar walls, wherein thethird and fourth planar walls are located on an exterior surface of theelectronic device when the electronic device is in the foldedconfiguration; a first set of components interposed between the firstplanar wall and the third planar wall; a second set of componentsinterposed between the second planar wall and the fourth planar wall; adisplay layer and a touch sensor layer that are both overlapped by thefirst and second planar walls and by the flexible wall, wherein thedisplay layer extends under the first and second curved sidewalls; andtouch sensor structures that are interposed between the third and fourthplanar walls when the electronic device is in the folded configuration,wherein the touch sensor structures gather touch sensor input through atleast one of the third and fourth planar walls.
 13. The electronicdevice defined in claim 12 wherein the first and second planar walls andthe flexible wall are formed from transparent plastic and wherein thedisplay layer comprises a flexible polymer substrate.
 14. The electronicdevice defined in claim 12 wherein the touch sensor structures extendunder both the third and fourth walls.
 15. The electronic device definedin claim 14 wherein the third and fourth walls are opaque.
 16. Theelectronic device defined in claim 12 wherein the first planar wallextends between the flexible wall and the first curved sidewall.
 17. Theelectronic device defined in claim 16 wherein the second planar wallextends between the flexible wall and the second curved sidewall andwherein the touch sensor layer extends under the first and second curvedsidewalls.
 18. The electronic device defined in claim 17 wherein thetouch sensor structures extend under the third and fourth walls andreceive touch input under the third and fourth walls.
 19. The electronicdevice defined in claim 12 further comprising fifth and sixth planarwalls and an additional flexible wall that lies between the second andfifth planar walls.
 20. The electronic device defined in claim 19wherein the display layer and the touch sensor layer are both overlappedby the fifth planar wall and the additional flexible wall.
 21. Theelectronic device defined in claim 12 wherein the display layer and thetouch sensor layer that are overlapped by the first and second planarwalls are configured to face away from each other during operations inthe folded configuration.
 22. The electronic device defined in claim 12further comprising: fifth and sixth planar walls and a first additionalflexible wall that lies between the second and fifth planar walls; andseventh and eighth planar walls and a second additional flexible wallthat lies between the fifth and seventh planar walls.
 23. The electronicdevice defined in claim 22 wherein the display layer and the touchsensor layer are both overlapped by the fifth planar wall, the firstadditional flexible wall, the seventh planar wall, and the secondadditional flexible wall.
 24. An electronic device, comprising: anenclosure having a transparent planar front wall with integral extendingtransparent edge portions that form at least part of opposing left andright sidewalls and having an opaque planar rear wall opposing thetransparent planar front wall, wherein the left and right sidewalls eachhave opposing inner and outer surfaces; flexible display and touchsensor layers formed under the transparent planar front wall and thetransparent edge portions, wherein the flexible display layer has firstand second opposing edges and wherein the touch sensor layer has a firstportion that extends beyond the first edge and overlaps the inner andouter surfaces of the left sidewall and a second portion that extendsbeyond the second edge and overlaps the inner and outer surfaces of theright sidewall; and a touch sensor under the opaque planar rear wall,wherein the opaque planar rear wall forms an exterior surface of theelectronic device.
 25. The electronic device defined in claim 24 whereinthe flexible display and touch sensor layers include an organiclight-emitting diode display layer and a transparent capacitive touchsensor layer interposed between the organic light-emitting diode displaylayer and the transparent planar front wall with integral extendingtransparent edge portions.
 26. The electronic device defined in claim 25wherein the transparent planar front wall with integral extendingtransparent edge portions is a glass layer with curved edge portionsforming the opposing left and right sidewalls.
 27. The electronic devicedefined in claim 26 wherein the opposing left and right sidewalls aretransparent and have curved profiles that extend between transparentplanar front wall and the opaque planar rear wall.